A design approach of bonding head guiding platform for die to wafer hybrid bonding application using compliant mechanism

Authors
Duc Nam Nguyen, Minh Phung Dang, Saurav Dixit & Thanh-Phong Dao
Publication year
2022
Index (WoS/Scopus)
Scopus
Publisher
Springer Nature
Journal
International Journal on Interactive Design and Manufacturing
Link
https://link.springer.com/article/10.1007/s12008-022-01019-4

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